Product Summary

The XC2V1000-4FF896C is a platform FPGA developed for high performance from low-density to high-density designs that are based on IP cores and customized modules. The XC2V1000-4FF896C delivers complete solutions for telecommunication, wireless, networking, video, and DSP applications, including PCI, LVDS, and DDR interfaces. The leading-edge 0.15μm / 0.12μm CMOS 8-layer metal process and the XC2V1000-4FF896C architecture is optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 10 million system gates, the XC2V1000-4FF896C enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gates arrays.

Parametrics

XC2V1000-4FF896C absolute maximum ratings: (1)Internal supply voltage relative to GND: –0.5 to 1.65 V; (2)Auxiliary supply voltage relative to GND: –0.5 to 4.0 V; (3)Output drivers supply voltage relative to GND: –0.5 to 4.0 V; (4)Key memory battery backup supply: –0.5 to 4.0 V; (5)Input reference voltage: –0.5 to VCCO + 0.5 V; (6)Input voltage relative to GND (user and dedicated I/Os): –0.5 to VCCO + 0.5 V; (7)Voltage applied to 3-state output (user and dedicated I/Os): –0.5 to 4.0 V; (8)Maximum soldering temp.: +220 ℃; (9)Operating junction temperature (2): +125 ℃.

Features

XC2V1000-4FF896C features: (1)Industry First Platform FPGA Solution; (2)SelectRAM Memory Hierarchy; (3)Dedicated 18-bit × 18-bit multiplier blocks; (4)Fast look-ahead carry logic chains; (5)Up to 93,184 internal registers / latches with Clock Enable; (6)Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers; (7)Wide multiplexers and wide-input function support; (8)Horizontal cascade chain and Sum-of-Products support; (9)Internal 3-state bussing.

Diagrams

XC2V1000-4FF896C block diagram

XC2V1000
XC2V1000

Other


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